AI isn’t slowing down, and Broadcom continues expanding its optical interconnect solutions portfolio for next-gen AI infrastructure. Today, we’re proud to announce the expansion of our industry-leading 200G/lane DSP PHY portfolio with the introduction of Sian3 and Sian2M, purpose-built for the demanding connectivity requirements of AI/ML clusters.
Learn more:
Broadcom Extends 200G/lane DSP PHY Leadership…
Introducing Sian3 and Sian2M, state-of-the-art technologies that provide unprecedented levels of power efficiency and cost optimization for next-generation AI infrastructure.
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